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"2008, E. G. Seebauer et al., Defect Engineering for Ultrashallow Junctions using Surfaces, in P. J. Timans, E. P. Gusev, H. Iwai, D.-L. Kwong, M. C. Öztürk, F. Roozeboom (editors), Advanced Gate Stack, Source/Drain, and Channel Engineering for Si-Based CMOS 4: New Materials, Processes, and Equipment, ECS Transactions: Volume 13, Issue 1, page 56, The second mechanism, which is the primary focus of the present paper, involves insertion of interstitials into dangling bonds at the surface."